Value Stakpak® TSOP DRAM Stacking
Entorian’s cost-effective Value Stakpak is designed especially for systems that require high-density memory but where thermal management is not as critical. Value Stakpak is used to stack DRAM components in order to achieve high-density memory modules used in products such as entry-level servers, communications systems and set-top boxes.
The Value Stakpak uses a standard design and assembly process. The interconnect consists of a singulated printed circuit board placed horizontally along the edges or leads of the TSOP. This design achieves impressive cost efficiencies for price-sensitive designs.
KEY FEATURES AND BENEFITS
- DDR, SDR, EDO memory types
- TSOP II packages
- PCB interposer between the package leads
APPLICATIONS
- DIMMs and for low-end PC server applications and networking switches and routers
- High-density memory-on-motherboard