Stakpak® BGA & TSOP DRAM Stacking
Entorian’s family of Stakpak DRAM device stacking technologies are industry-leading solutions to double the memory capacity in the same device footprint—using industry standard, commodity DRAM devices. Our Stakpak products are cost-effective and deliver ultimate supply chain flexibility. Our Stakpak solutions exist for TSOP and BGA packages and for DDR2, DDR and SDR memory types supporting a wide variety of JEDEC-standard ballouts.
Depending on your business needs, Stakpak® DRAM stacking technologies are available as a StakpakSM technology license, as a Entorian-provided Stakpak manufacturing service that utilizes our world-class assembly and test capabilities, or as a finished Entorian Stakpak stacked DRAM product.
The High Performance Stakpak® CSP DRAM Stacking (BGA)
The High Performance Stakpak is Entorian’s Chip-Scale Packaging (CSP) stacking solution. Two BGA DRAM devices are interconnected with a flexible circuit, resulting in a surface mountable memory device of twice the capacity of a single DRAM device.
- DDR2 memory types, up to DDR2-800 speeds
- BGA chip-scale packages
- Flexible circuit interposer between the packages
Performance Stakpak® TSOP DRAM Stacking
The Performance Stakpak enables the stacking of TSOP DRAMs at speeds up to DDR-400. The use of a flexible circuit keeps the overall stack height to a minimum.
- DDR, SDR, EDO memory types
- TSOP II packages
- Flexible circuit interposer between the packages
Value Stakpak® TSOP DRAM Stacking
The Value Stakpak is a cost-effective solution to double the capacity of TSOP devices utilizing a PCB interconnect between the package leads.
- DDR, SDR, EDO memory types
- TSOP II packages
- PCB interposer between the package leads