Performance Stakpak TSOP DRAM Stacking
Leading computer manufacturers employ our Performance Stakpak in server and workstation products. It is also ideal in storage systems, networking switches and routers, and a variety of other commercial, industrial and military applications where high-density memory is required.
The Performance Stakpak stacks thin, small outline packages (TSOPs) in two-high or four-high configurations, utilizing a patented technology that provides an electrical interconnect and enhanced thermal performance for standard packaged DRAM chips in an industry standard footprint.
In addition, the interconnect system acts as a heat spreader to conduct thermal energy from the center of the stack to the sides and thermally couples the devices. The enhanced thermal properties allow the Performance Stakpak to achieve better heat dissipation and lower die temperatures than an unstacked TSOP.
KEY FEATURES AND BENEFITS
- DDR, SDR, EDO memory types
- TSOP II packages
- Flexible circuit interposer between the packages
APPLICATIONS
- DIMMs for servers and workstations, storage systems and networking switches and routers
- High-density memory-on-motherboard