Advanced Memory Modules
Entorian's advanced memory modules are engineered to meet the needs of the most demanding OEMs and end users in market segments like servers, networking, telecommunications and high-performance computing. Many times, our modules incorporate one of our high-density memory technologies like ArctiCore or our Stakpak products to deliver the required memory capacity in an economical way.
Entorian's engineering and operational capabilities allow us to deliver the highest-quality modules on time. Our areas of expertise include electrical, mechanical and thermal module design, design qualification (verification and validation), manufacturing test development, Highly Accelerated Life Test (HALT), environmental stress screening, industrial temperature screening, Highly Accelerated Stress Screening (HASS), BOM control / build exact, failure analysis and root cause analysis, as well as product change notification.
We are currently offering JEDEC-compliant, as well as custom, memory modules, in RDIMM (incl VLP), FBDIMM, UDIMM and SODIMM form factors utilizing DDR2, DDR and SDR memory technologies.
High-Density Memory Modules
Economically delivering high-capacity memory modules in the ever-changing DRAM market is a challenge. Entorian is able to offer high-density memory modules that utilize a variety of assembly technologies, including Entorian's Stakpak DRAM stacking, ArctiCore module technologies, as well as dual-die DRAM packages.
Utilizing these high-density technologies, we can currently deliver 8GB and 16GB standard-size modules, and 4GB and 8GB low-profile modules.
Adding Entorian's long history in delivering leading engineering and manufacturing services to these technologies creates a winning combination.
To learn more about Entorian's high-density memory modules for your application,
please contact us directly.
Standard Density Memory Modules
Today's enterprise applications require highly reliable 2GB and 4GB memory modules to be delivered in a cost-effective way. Our long history of high-volume module assembly has allowed us to perfect our engineering and operations processes and puts us into the position to meet the modules needs of the most demanding OEMs and large end users.
To learn more about Entorian's high-density memory modules for your application,
please contact us directly.
Thermally Optimized Memory Modules
Thermal considerations are moving into the forefront of memory sub-system design, and Entorian has been analyzing, designing and delivering thermally enhanced memory modules for several years.
Utilizing technologies like ArctiCore (with an integrated thermal
management solution), our Stakpak products (with thermally advanced
interconnect technologies), as well as conventional thermal management approaches (e.g. external heat spreaders), Entorian's thermally optimized memory modules result in lower DRAM temperatures while putting fewer demands on the system cooling resources.
Currently, we can deliver thermally enhanced RDIMMs (Full-Size and VLP), FBDIMMs and SO-DIMMs.
To learn more about Entorian's high-density memory modules for your application,
please contact us directly.
Custom Memory Modules
Entorian combines a wealth of unique module and component technologies with a very experienced DIMM engineering team to address your custom memory module needs. Our module design team includes electrical / signal integrity, mechanical, thermal and test engineers that have successfully delivered multiple custom high-perforance module designs, using conventional FR4 boards as well as our ArctiCore module technologies.
To learn more about Entorian's high-density memory modules for your application,
please contact us directly.