Entorian Products and Technology
Advanced Memory Modules
Entorian's advanced memory modules are engineered to meet the needs of the most demanding OEMs and end users in market segments like servers, networking, telecommunications and high-performance computing. Many times our modules incorporate one of our high-density memory technologies like ArctiCore or Stakpak to deliver the required memory capacity in an economical way. We are offering JEDEC-compliant, as well as custom memory modules, in RDIMM (incl VLP), FBDIMM, UDIMM and SODIMM form factors utilizing DDR2, DDR and SDR memory technologies.
Stakpak® BGA & TSOP DRAM Stacking
The Stakpak product family includes cost-effective solutions for doubling, tripling or quadrupling the memory capacity in a single device footprint utilizing commodity DRAM components. Consisting of three distinct technologies, Stakpak supports a complete set of DRAM technologies and packages.
ArctiCore™ Module Technologies
ArctiCore is a new module technology designed for superior thermal, mechanical and electrical performance. It increase the system's operational performance by doubling, tripling or quadrupling the amount of memory in the same physical footprint as required by standard packaging technology. ArctiCore utilizes a double-sided, multi-layer flexible circuit with embedded interconnect technologies folded around a rigid thermal core and can be used in JEDEC-compatible modules as well as custom DIMMs.
FlashStak™ TSOP FLASH Stacking
FlashStak enables the highest-capacity data storage solution with commodity TSOP NAND Flash devices for applications such as USB drives, MP3 players, portable video players, PDAs and other consumer electronic devices requiring high-capacity storage in a small device form factor. FlashStak enables stacking multiple Flash devices while maintaining the footprint of a single standard TSOP package.
MobileStak™ System Module Solutions
MobileStak™ is a chip-stacking solution that enables smaller mobile products by combining virtually any processor, controller and memory device into a single, small footprint module. The MobileStak designs can integrate a variety of chip packages, as well as devices provided as bare die. Now available for sampling is a MobileStak reference design that integrates the FreeScale i.MX31 processor with a Micron 64MB mobile DRAM device, both supplied in pre-tested BGA packages.