High Performance Stakpak CSP DRAM Stacking (BGA)
Now available in its second generation, the High Performance Stakpak leverages commodity memory devices in CSP packages, flexible manufacturing capabilities and more than 15 years of stacking expertise to produce the next generation of stacked memory devices.
Stacked CSP devices combine commodity memory devices, flex circuit technology and thermal management to make stacks of memory devices in JEDEC-standard footprints.
The High Performance Stakpak technologies enable efficient use of PCB real estate, maximizing the memory capacity of your memory module or system.
KEY FEATURES AND BENEFITS
- DDR1 up to DDR-400 speed, DDR2 up to DDR2-800 speeds
- BGA chip-scale packages
- Flexible circuit interposer between the packages
- Stack width only 0.8mm nominal, 1.0mm max wider than DRAM package width
APPLICATIONS
- DIMMs for servers and workstations, storage systems and networking switches and routers
- High-density memory-on-motherboard