Custom FBDIMMs
Using the ArctiCore module technology, we can design custom FBDIMMs that meet platform-specific size, capacity, rank and thermal requirements. For example, on a double-high FBDIMM, we can place up 72 large DRAM devices. Also, dual-die DRAM devices can be supported.
The thermal solution of the FBDIMM can be optimized for the specific platform by varying the height, thickness or material of the thermal core in the center of the ArctiCore module.
Customer-specific components, e.g., to deliver unique performance or high-availability features, can easily be incorporated.
KEY FEATURES AND BENEFITS
- Double the mounting area compared to conventional DIMM designs
- Thinner than conventional high-density FBDIMMs
- Superior thermal performance based on integrated thermal core
- Improved mechanical reliability compared to conventional DIMMs
- Superior electrical performance by integrating flexible circuit technology, resulting in wider signal integrity margins
- Speeds up to DDR2-800
APPLICATIONS
- Servers
- Workstations
- Networking Products
