ArctiCore™ Module Technologies
ArctiCore utilizes a double-sided, multi-layer flexible circuit with embedded interconnect technologies folded around a rigid thermal core and can be used in JEDEC-compatible modules as well as custom DIMMs. This delivers superior thermal, mechanical and electrical performance and increases a system's operational performance by doubling, tripling or quadrupling the amount of memory in the same physical footprint as required by standard packaging technology.
Depending on your business needs, ArctiCore® advanced module technologies are available as an ArctiCore technology license, as a Entorian-provided ArctiCore custom manufacturing service that utilizes our world-class assembly and test capabilities, or as a finished Entorian ArctiCore module product.
DDR2 ArctiCore Modules
We have designed a number of JEDEC-compatible, high-capacity DDR2 DIMMs, in RDIMM, VLP-RDIMM and FBDIMM configurations, as well as thermally enhanced 38mm options. Using the ArctiCore advanced circuit technologies, speeds of up to DDR2-800 have been achieved.
Custom ArctiCore Modules
Using the ArctiCore module technologies, we can design custom DIMMs that meet platform-specific size, capacity, rank and thermal requirements.