Standard High-Density Memory Modules
Entorian technologies are widely used to deliver cost-effective, high-density DIMMs that comply with JEDEC-standard size envelopes and connectivity. ArctiCore™ module technologies double the DRAM mounting area of the DIMM while providing integrated thermal management. Alternatively, Stakpak® DRAM package stacking can be used to double the DRAM capacity in a single device footprint on a large number of JEDEC raw card designs.
KEY FEATURES AND BENEFITS
- Utilizes standard, commodity DRAM to deliver most cost-effective 4GB DIMMs in the industry
- Doubles the DRAM capacity in the same device footprint
- Superior mechanical performance
- Exceptional signal integrity due to use of flexible circuit
- For ArctiCore:
- Superior thermal performance via integrated thermal core
- Standard SMT manufacturing process
APPLICATIONS
- Server DIMMs (RDIMM & FBDIMM, incl. VLP)
- Workstation DIMMs (RDIMM, FBDIMM)
- Portable PC DIMMs (SODIMM)
- Networking DIMMs (various DIMM types)