Optimized Sub-Systems
Entorian 3D technologies are used to optimize a selected sub-system for board footprint, cost, thermal and electrical performance as well as component flexibility. This is enabled by the use of a flexible circuit that is folded to create the desired density. A good example of a sub-system optimized with Entorian technologies is the ArctiCore module technologies applied to RDIMM and FBDIMM memory sub-systems.
KEY FEATURES AND BENEFITS
- Multiplies the device mounting area in a singe board footprint
- Flexible circuit provides superior electrical properties
- Integrated thermal management as needed
- Option to re-ball the complete sub-system for SMT placement
- Option to create edge card-style connector
- Can be applied to mixed-memory sub-systems as well as sub-systems consisting of memory and logic devices
- Significantly lower cost-to-market and faster time-to-market than specialty 3D chip packaging alternatives
APPLICATIONS
- Memory modules
- Mixed memories, e.g. DRAM and FLASH
- Controller + memories
- Processor + memories
- ASIC + memories
- Multiple ASICs
- Processor + Co-Processors