High-Density Memory on Motherboard
Stakpak® DRAM package stacking can double the DRAM capacity in virtually any motherboard design without increasing the board space dedicated to the memory sub-system. Or, if you are looking to reduce motherboard space, Stakpak technologies allow you to cut the number of DRAM sites on the motherboard in half while maintaining your total memory capacity.
KEY FEATURES AND BENEFITS
- Utilizes standard, commodity DRAM to deliver high-density solutions
- Doubles the DRAM capacity in the same device footprint
- Superior mechanical performance over BGA DRAM packages mounted directly on a PCB board
- Exceptional signal integrity due to use of flexible circuit
APPLICATIONS
- Networking Systems
- Ultra-Portable PCs
- Embedded & Industrial Systems