DRAM and DRAM Module Manufacturers

Networking OEM/ODM

Computing and networking OEMs are demanding higher memory capacity while increasing their requirements for thermal performance, signal integrity and continuity of supply. Of course, overall expectations for continued cost reductions over time remain in place.

Your customers are asking for cost-effective, high-density DIMMs…

As the overall demand for more system memory capacity increases, customer expectations for lower memory cost over time require highly cost-effective technology solutions for high-density DIMMs.

Entorian Offers…

Standard High-Density Memory Modules
Using standard, commodity DRAM is key to a cost-leading, high-density DIMM solution. ArctiCore™ module technologies are cost-effective, high-density DIMM technologies. Alternatively, Stakpak DRAM package stacking also delivers mature, cost-effective and high-density DIMMs.
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Custom High-Density Memory Modules
Both ArctiCore and our Stakpak products can be effectively used to deliver custom DIMM form factors that utilize commodity DRAMs.
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Your customers are asking for more memory in the same board footprint…

Smaller DIMM form factors like VLP DIMMs, SO-DIMMs and Mini-DIMMs are emerging in response to OEMs’ desire to shrink system sizes. However, memory capacity demands remain high for these smaller form factors.

Entorian Offers…

High-Density Memory on Motherboard
Stakpak DRAM package stacking allows doubling the DRAM capacity in the same single DRAM device footprint.
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High-Density Memory
ArctiCore module technologies double the available component mounting area. Alternatively, Stakpak DRAM package stacking allows the doubling of the DRAM capacity in the same single DRAM device footprint.
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Your customers are asking for DIMMs with superior thermal performance and signal integrity…

As DRAM speeds progress to DDR2-667, DDR2-800 and DDR3, both good heat dissipation as well as strong signal integrity are becoming critical DIMM requirements.

Entorian Offers…

High-Density Memory
Entorian’s flex circuit-based, high-density technologies deliver superior signal integrity compared to conventional board technologies. ArctiCore module technologies also deliver integrated thermal management, resulting in superior thermal performance of the DIMM.
Learn MoreStandard High-Density Memory Modules
Learn MoreCustom High-Density Memory Modules