Custom High-Density Memory Modules
Entorian technologies are widely used in custom high-density DIMMs. ArctiCore™ module technologies double the DRAM mounting area of the DIMM while providing integrated thermal management. Alternatively, Stakpak® DRAM package stacking can be used to double the DRAM capacity in the same device footprint.
KEY FEATURES AND BENEFITS
- Utilizes standard, commodity DRAM to deliver high-density DIMMs
- Doubles the DRAM capacity in the same device footprint
- Superior mechanical performance
- Exceptional signal integrity due to use of flexible circuit
- For ArctiCore:
- Superior thermal performance via integrated thermal core
- Standard SMT manufacturing process
APPLICATIONS
- Server DIMMs
- Networking DIMMs
- Workstation DIMMs