Contract Manufacturers
As an electronics contract manufacturer, you need to continuously respond to customer demands for higher integration and lower cost - both delivered in Entorian’s high-density technologies.
Your customers are asking for less board space dedicated to memory and other sub-systems…
Saving board space is a key driver to reduce overall system cost and enables new system form factors. However, the chosen 3D technology has to be highly manufacturable and cost effective.
Entorian Offers…
- Optimized Sub-Systems
- Entorian’s flexible circuit 3D technology allows you to reduce motherboard space while providing you with the flexibility to use the most cost effective component set for your system.
Learn More- High-Density Memory
- ArctiCore™ module technologies double the available component mounting area. Alternatively, Stakpak DRAM package stacking allows doubling the DRAM capacity in the same single DRAM device footprint.
- Standard High-Density Memory Modules
- Custom High-Density Memory Modules
- High-Density Memory on Motherboard
- Stakpak DRAM package stacking allows the cost-effective doubling of the DRAM capacity in the same single DRAM device footprint.
- Learn More