Consumer Electronics OEM/ODM

New small form-factor products are sending shock waves through the industry, even as storage capacity and battery life are on the rise.

Consumers are demanding ultra-thin products that store hours of content and run sophisticated applications…

As performance demands increase, form factors are typically not changing, resulting in the need to fit more memory and more processing power into a fixed envelope. As a result, packaging, thermal and signal integrity challenges increase over time.

Entorian Offers…

FlashStak™ TSOP Flash Stacking

FlashStak X-2 offers doubling the capacity by vertically stacking two Flash devices while maintaining the footprint of a single standard TSOP package. Based on Entorian’s proven high-volume, high-yield Stakpak technologies, FlashStak uses standard design and assembly processes consisting of a singulated printed circuit board (PCB) interconnect placed horizontally along the edges or leads of the stacked TSOP devices. The resulting stack achieves impressive height profile, product reliability and cost efficiency.

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