Computer OEM/ODM
As computer performance continues to increase and physical system size decreases, technical challenges like thermal performance and signal integrity become more pronounced. Entorian's technologies address these challenges while also providing cost-effective, high-density solutions.
Your customers are asking for more system memory…
The demands for system memory continue to increase, driven by higher performance expectations, multi-core CPUs, new operating systems, and ever-increasing file sizes, e.g. for digital media editing. High-density memory modules are the solution to balance increased memory capacity with costly motherboard space.
Entorian Offers…
- Advanced Memory Modules
Entorian is meeting the memory module needs of the most demanding OEMs in server computing, networking enterprise storage and high-performance computing. We are in a unique position to incorporate our various high-density technologies into our module designs. In addition, we bring a wealth of engineering and manufacturing experience so that you receive the highest-quality modules.
Entorian Offers…
- High-Density Memory on Motherboard
Stakpak DRAM package stacking allows doubling the DRAM capacity in the same single DRAM device footprint.
Your customers are asking for more cost-effective systems…
Reducing overall system cost remains a top priority. Being able to use the most cost-effective memory components is a key part of overall system cost. In addition, reducing the motherboard size while accommodating the same amount of components results in less expensive motherboards.
Entorian Offers…
- High-Density Memory
One of the key benefits of our memory module technologies is the fact that they deliver cost-effective, high-capacity memory by assembling a larger number of memory components onto a JEDEC-compatible or custom DIMM form factor. Our technologies allow two, three or four memory devices to share a single board footprint. This also means you are utilizing less costly, widely available memory components to create your highest-capacity offerings.
Advanced Memory ModulesHigh-Density Memory on Motherboard
Your customers are asking for smaller systems…
Smaller systems are highly desirable for portable PCs, as well as new data center solutions like blade servers. In many cases, this means reduced motherboard space and fewer DIMM sockets. Technology that allows the system designer to cost-effectively accommodate the same amount of components in a smaller footprint is key to enabling next-generation form factors.
Entorian Offers…
- Optimized Sub-Systems
Entorian's flexible circuit technology can be used to create 3D sub-systems that multiply the device mounting area in the same footprint. ArctiCore module technologies are one example of Entorian's technologies of optimized sub-systems.
Entorian Offers…
- High-Density Memory
By utilizing Entorian's high-density DRAM technologies, more memory can be supported in the same amount of motherboard space - either as high-density modules in a smaller number of DIMM sockets, very low-profile memory modules (VLP) or as DRAM stacks on the motherboard.
Advanced Memory ModulesHigh-Density Memory on Motherboard